Dry resist lamination for wafer-scale fabrication of microfluidic superfusion devices
Journal article, 2025
We present a cleanroom fabrication process of free-standing open space microfluidic devices with channel widths of ~ 30 µm on the wafer scale by means of photolithography in combination with lamination technology.
Microfluidic chips
Multilayer lamination
Open space microfluidics
Dry film photoresist
Author
Rui Liu
Chemistry and Biochemistry Phd Students and Postdocs
Esteban Pedrueza Villalmanzo
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Aldo Jesorka
Chalmers, Chemistry and Chemical Engineering
Scientific Reports
2045-2322 (ISSN) 20452322 (eISSN)
Vol. 15 1 32929-Subject Categories (SSIF 2025)
Chemical Sciences
DOI
10.1038/s41598-025-19744-7
PubMed
40999095