Dry resist lamination for wafer-scale fabrication of microfluidic superfusion devices
Artikel i vetenskaplig tidskrift, 2025
We present a cleanroom fabrication process of free-standing open space microfluidic devices with channel widths of ~ 30 µm on the wafer scale by means of photolithography in combination with lamination technology.
Microfluidic chips
Multilayer lamination
Open space microfluidics
Dry film photoresist
Författare
Rui Liu
Kemi och biokemi doktorander och postdocs
Esteban Pedrueza Villalmanzo
Chalmers, Mikroteknologi och nanovetenskap, Nanotekniklaboratoriet
Aldo Jesorka
Chalmers, Kemi och kemiteknik
Scientific Reports
2045-2322 (ISSN) 20452322 (eISSN)
Vol. 15 1 32929-Ämneskategorier (SSIF 2025)
Kemi
DOI
10.1038/s41598-025-19744-7
PubMed
40999095