Hot Embossed Microoptics in Silicon Micromachining using a Substrate Bonder
Paper in proceedings, 2008

Author

Karin Hedsten

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Caglar Ataman

Sven Holmström

Peter Enoksson

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Hakan Urey

Proceedings of 19th MicroMechanics Europe Workshop, MME 2008

137-140

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

978-3-00-025529-8

More information

Created

10/6/2017