Thermal cycling and reliability of lead free BGA components

Cristina Andersson; Dag Andersson; Johan Liu

Thermal cycling and reliability of lead free BGA components
Paper in proceeding, 2005

Author

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Dag Andersson

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

IMAPS Europe Brugge

pp101-108

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017

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Thermal cycling and reliability of lead free BGA components Paper in proceeding, 2005