Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions
Other conference contribution, 2010
Author
Masahiro Inoue
H Muta
S Yamanaka
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
IEEE CPMT Electronics System Integration Conference (ESTC)
Subject Categories
Other Materials Engineering
Areas of Advance
Materials Science