Influence of substrate on electrical conductivity of isotropic conductive adhesive
Paper in proceeding, 2011

Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.


Zhili Hu

Chalmers, Applied Physics, Electronics Material and Systems

Wenhui Du

Shanghai University

Cong Yue

Shanghai University

Lilei Ye

SMIT Ltd. Co.

Zhichao Yuan

SMIT Ltd. Co.

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011

1550-5723 (ISSN)

330 - 335
978-1-4673-0148-0 (ISBN)

Areas of Advance


Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering





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