Plasma assisted low temperature wafer bonding: void formation in the oxide free interface
Paper in proceeding, 2003
Author
Petra Amirfeiz
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Anke Sanz-Velasco
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Stefan Bengtsson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 7th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Paris, France (2003)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering