On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams
Journal article, 2011
A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations
Thin film testing
Fracture strength of silicon
Silicon nanowires
Piezoresistivity
Mechanical and electro-mechanical properties of silicon
Surface states
Environmental impact on measurement
On-chip tensile testing
MEMS/NEMS
Nano-mechanical testing
Fracture
Author
U. Bhaskar
V. Passi
Ulf Södervall
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Bengt Nilsson
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Göran Petersson
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Mats Hagberg
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
T. Pardoen
J.-P. Raskin
Advanced Materials Research
1022-6680 (ISSN) 1662-8985 (eISSN)
Vol. 276 117-126Subject Categories
Physical Sciences
DOI
10.4028/www.scientific.net/AMR.276.117