Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range
Journal article, 2012

After the use of the bed of nails for removing cavity modes in microstrip circuit packages, we propose herein a new version of this periodic structure, based on helices (springs) instead of nails. This new structure, named bed of springs, is much more compact, and this allows its use at low frequencies where the bed of nails is not suitable as it is too bulky due to the required height of the nails (pins). The bandwidth of the proposed structure turns out to be similar to the case of bed of nails. Parametric studies are presented as a design tool and a demonstrator is manufactured and measured.

nails

soft surfaces

packaging

parallel plate mode

Artificial magnetic conductor (AMC)

electromagnetic-bandgap

gap waveguide

Author

Eva Rajo

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Per-Simon Kildal

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Ashraf Uz Zaman

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

A. Kishk

Concordia University

IEEE Transactions on Components, Packaging and Manufacturing Technology

2156-3950 (ISSN)

Vol. 2 1623-1628 6280647

Areas of Advance

Information and Communication Technology

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/TCPMT.2012.2207957