Thermal Fatigue Cracking of Surface Mount Conductive Adhesive Joints
Journal article, 2004

Author

Z. Mo

Zonghe Lai

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

S. Li

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Other publications Research

Soldering & Surface Mount Technology

Vol. 16 1 pp 48-52

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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