In Situ Growth of CVD Graphene Directly on Dielectric Surface toward Application
Journal article, 2020

A technique for the in situ growth of patterned graphene by CVD has been achieved directly on insulating substrates at 800 degrees C. The graphene growth is catalyzed by a Ni-Cu alloy sacrificial layer, which integrates many advantages such as being lithography-free, and almost wrinkle-free, with a high repeatability and rapid growth. The etching method of the metal sacrificial layer is the core of this technique, and the mechanism is analyzed. Graphene has been found to play an important role in accelerating etching speeds. The Ni-Cu alloy exhibits a high catalytic activity, and thus, high-quality graphene can be obtained at a lower temperature. Moreover, the Ni-Cu layer accommodates a limited amount of carbon atoms, which ensures a high monolayer ratio of the graphene. The carbon solid solubility of the alloy is calculated theoretically and used to explain the experimental findings. The method is compatible with the current semiconductor process and is conducive to the industrialization of graphene devices.

chemical vapor deposition

graphene

insulating substrate

in situ growth

lithography-free

Author

Yibo Dong

Beijing University of Technology

Sheng Guo

Chalmers, Industrial and Materials Science, Materials and manufacture

Huahai Mao

Thermo-Calc Software

Royal Institute of Technology (KTH)

Chen Xu

Beijing University of Technology

Yiyang Xie

Beijing University of Technology

Jun Deng

Beijing University of Technology

Le Wang

Beijing University of Technology

Zaifa Du

Beijing University of Technology

Fangzhu Xiong

Beijing University of Technology

Jie Sun

Chalmers, Microtechnology and Nanoscience (MC2), Quantum Device Physics

ACS Applied Electronic Materials

26376113 (eISSN)

Vol. 2 1 238-246

Subject Categories

Materials Chemistry

Metallurgy and Metallic Materials

Condensed Matter Physics

Areas of Advance

Materials Science

DOI

10.1021/acsaelm.9b00719

More information

Latest update

4/21/2023