Enabling Solutions for Integration and Interconnectivity in Millimeter-wave and Terahertz Systems
Doctoral thesis, 2020

Recently, Terahertz (THz) systems have witnessed increasing attention due to the continuous need for high data rate transmission which is mainly driven by next-generation telecommunication and imaging systems. In that regard, the THz range emerged as a potential domain suitable for realizing such systems by providing a wide bandwidth capable of achieving and meeting the market requirements. However, the realization of such systems faces many challenges, one of which is interconnectivity and high level of integration. Conventional packaging techniques would not be suitable from performance perspective above 100 GHz and new approaches need to be developed. This thesis proposes and demonstrates several approaches to implement interconnects that operate above 100 GHz. One of the most attractive techniques discussed in this work is to implement on-chip coupling structures and insert the monolithic microwave integrated circuit (MMIC) directly into a waveguide (WG). Such approach provides high level of integration and eliminates the need of galvanic contacts; however, it suffers from a major drawback which isthe propagation of parasitic modes in the circuit cavity if the MMIC is large enough to allow such modes to propagate. To mitigate this problem, this work suggests and investigates the use of electromagnetic bandgap (EBG) structures that suppresses those modes such as bed of nails and mushroom-type EBG structures. The proposed techniques are used to implement several on-chip packaging solutions that have an insertion loss as low as 0.6 dB at D-band (110-170 GHz). Moreover, the solutions are demonstrated in several active systems using various commercial MMIC technologies. The thesis also investigates the possibility of utilizing the commercially available packaging technologies such as Embedded Wafer Level Ball Grid Array (eWLB) packaging. Such technology has been widely used for integrated circuits operating below 100 GHz but was not attempted in the THz range before. This work attempts to push the limits of the technology and proposes novel solutions based on coupling structures implemented in the technology’s redistribution layers. The proposed solutions achieve reasonable performance at D-band that are suitable for low-cost mass production while allowing heterogeneous integration with other technologies as well. This work addresses integration challenges facing systems operating in the THz range and proposes high-performance interconnectivity solutions demonstrated in a wide range of commercial technologies and hence enables such systems to reach their full potential and meet the increasing market demands.

Integration

Interconnects

Waveguide transitions

Embedded Wafer Level Ball Grid Array (eWLB)

Electromagnetic band-gap (EBG)

Millimeter waves

Packaging

Terahertz

Monolithicmicrowave integrated circuit (MMIC)

Kollektorn, Kemivägen 9, Göteborg, Sweden
Opponent: Assoc. Professor: Tom Johansen, Technical University of Denmark

Author

Ahmed Adel Hassona

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

D-band waveguide-to-microstrip transition implemented in eWLB packaging technology

Electronics Letters,; Vol. 56(2020)p. 187-+

Journal article

Nongalvanic Generic Packaging Solution Demonstrated in a Fully Integrated D-Band Receiver

IEEE Transactions on Terahertz Science and Technology,; Vol. 10(2020)p. 321-330

Journal article

Demonstration of +100-GHz Interconnects in eWLB Packaging Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology,; Vol. 9(2019)p. 1406-1414

Journal article

F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging

2019 49th European Microwave Conference, EuMC 2019,; (2019)p. 432-435

Paper in proceeding

Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems

IEEE Transactions on Terahertz Science and Technology,; Vol. 9(2019)p. 624-636

Journal article

D-band SiGe transceiver modules based on silicon-micromachined integration

Asia-Pacific Microwave Conference Proceedings, APMC,; Vol. 2019-December(2019)p. 883-885

Paper in proceeding

A Low-loss D-band Chip-to-Waveguide Transition Using Unilateral Fin-line Structure

IEEE MTT-S International Microwave Symposium,; Vol. 2018(2018)p. 390-393

Paper in proceeding

Silicon Taper Based D-Band Chip to Waveguide Interconnect for Millimeter-Wave Systems

IEEE Microwave and Wireless Components Letters,; Vol. 27(2017)p. 1092-1094

Journal article

A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology

IEEE MTT-S International Microwave Symposium Digest,; (2017)p. 510-512

Paper in proceeding

Lösningar för trådlös kommunikation med hög datatakt

Swedish Foundation for Strategic Research (SSF) (SE13-0020), 2014-03-01 -- 2019-06-30.

Micromachined terahertz systems -a new heterogeneous integration platform enabling the commercialization of the THz frequency spectrum (M3TERA)

European Commission (EC) (EC/H2020/644039), 2015-02-01 -- 2017-12-31.

Car2TERA

European Commission (EC) (EC/H2020/824962), 2019-01-01 -- 2022-03-31.

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

978-91-7905-375-8

Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 4842

Publisher

Chalmers

Kollektorn, Kemivägen 9, Göteborg, Sweden

Online

Opponent: Assoc. Professor: Tom Johansen, Technical University of Denmark

More information

Latest update

11/19/2020