Qubit-Compatible Substrates With Superconducting Through-Silicon Vias
Journal article, 2022
We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.
Qubit
Q-factor
superconducting through-silicon via
titanium nitride
Electrodes
tantalum
quantum coherence
Superconducting microwave devices
Through-silicon vias
High-Q resonator
TSV
Resonators
Semiconductor device measurement
Author
K. Grigoras
Technical Research Centre of Finland (VTT)
Nikolai Yurttagül
Technical Research Centre of Finland (VTT)
J. P. Kaikkonen
Technical Research Centre of Finland (VTT)
E. T. Mannila
Technical Research Centre of Finland (VTT)
P. Eskelinen
Technical Research Centre of Finland (VTT)
D. P. Lozano
H. X. Li
Marcus Rommel
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Daryoush Shiri
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
N. Tiencken
Technical Research Centre of Finland (VTT)
S. Simbierowicz
Technical Research Centre of Finland (VTT)
A. Ronzani
Technical Research Centre of Finland (VTT)
J. Hatinen
Technical Research Centre of Finland (VTT)
D. Datta
Technical Research Centre of Finland (VTT)
V. Vesterinen
Technical Research Centre of Finland (VTT)
L. Gronberg
Technical Research Centre of Finland (VTT)
Janka Biznárová
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Anita Fadavi Roudsari
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Sandoko Kosen
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Amr Osman
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
Mika Prunnila
Technical Research Centre of Finland (VTT)
J. Hassel
Technical Research Centre of Finland (VTT)
Jonas Bylander
Chalmers, Microtechnology and Nanoscience (MC2), Quantum Technology
J. Govenius
Technical Research Centre of Finland (VTT)
IEEE Transactions on Quantum Engineering
26891808 (eISSN)
Vol. 3 5100310Subject Categories
Other Physics Topics
Other Electrical Engineering, Electronic Engineering, Information Engineering
Condensed Matter Physics
DOI
10.1109/TQE.2022.3209881