A Corrugated Planar-Goubau-Line Termination for Terahertz Waves
Journal article, 2023

The planar Goubau line is a promising low-loss metal waveguide for terahertz applications. To enable advanced circuits and multi-port measurements based on planar Goubau lines, there is a strong need for broadband impedance-matched loads, which can be used to absorb the energy and minimize standing waves in a system. In this work, we propose a termination for planar Goubau lines based on an exponentially-tapered corrugated line, gradually increasing conductor losses while maintaining small reflections. The corrugation density is high enough to increase conductor losses without requiring an auxiliary low-conductivity material. A 400-µm long planar Goubau line load was fabricated on a 10-µm thick silicon substrate suspended in the air. Simulations of the load show excellent agreement with calibrated reflection measurements in the frequency range 0.5 THz – 1.1 THz. Above the cut-off frequency of around 580 GHz, the measured reflections are less than -19 dB, below the noise floor of the characterization setup.

Silicon-on-insulator

Matched load

Terahertz waveguides

On-wafer measurements

Submillimeter wave circuits

Scattering parameters

Suspended substrate

Planar Goubau line

Corrugated line

Author

Juan Cabello Sánchez

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Vladimir Drakinskiy

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Jan Stake

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

Helena Rodilla

Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory

IEEE Microwave and Wireless Technology Letters

2771-957X (ISSN) 2771-9588 (eISSN)

Vol. 33 6 643-646

Areas of Advance

Information and Communication Technology

Infrastructure

Kollberg Laboratory

Nanofabrication Laboratory

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/LMWT.2023.3239984

More information

Latest update

6/7/2023 6