Reliability aspects of electronics packaging technology using anisotropic conductive adhesives
Journal article, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Liqiang Cao

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Journal of Shanghai University (English Edition)

Vol. 11 1-16

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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