Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Journal article, 2007

Author

Sun Peng

Chalmers, Microtechnology and Nanoscience (MC2)

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Journal of Alloys and Compounds

Subject Categories

Materials Engineering

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12/13/2018

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