Realization of A Ultra Wideband BPF based on LCP Substrate for Wireless Application
Paper in proceeding, 2007

Author

Xia Zhang

Chalmers, Microtechnology and Nanoscience (MC2)

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2)

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017