Reliability characterisation of lead free solder joints using three point bending test
Paper in proceeding, 2007
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering