Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip application
Journal article, 2000
Author
Kuntjoro Pinardi
Zonghe Lai
Department of Microelectronics and Nanoscience
Dietmar Vogel
Yi Lan Kang
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Sheng Liu
Ralf Haug
Magnus Willander
IEEE CPMT Transactions, Part A
Vol. 23 447-451
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering