Reliability of ACA flip-chip joints on FR-4 substrate
Journal article, 2002

Author

Johan Liu

Department of Microelectronics and Nanoscience

Other publications Research

Zonghe Lai

Department of Microelectronics and Nanoscience

Other publications Research

Journal of Electronics packaging

240-245

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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