RF Characterisation of Flip-Chip Aniostropic Conductive Adhesive Joints
Paper in proceeding, 2006
Author
Xu Wang
Zhaonian Cheng
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06)
123-127
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering