Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Paper in proceedings, 2006
Author
Teng Wang
Chalmers, Microtechnology and Nanoscience (MC2)
Martin Jönsson
University of Gothenburg
Eleanor E B Campbell
University of Gothenburg
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006
Vol. 2 892-895
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ESTC.2006.280117
ISBN
978-142440552-7