Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
Paper in proceeding, 2009
Author
Xiuzhen Lu
Li Xu
Huaxiang Lai
Xinyu Du
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1051-1053
Subject Categories
Materials Engineering