D-band waveguide-to-microstrip transition implemented in eWLB packaging technology
Journal article, 2020

This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution layers. The patch radiates to a WR-6.5 standard waveguide perpendicular to its plane. An electromagnetic band-gap structure realised by metal patches is used to suppress undesired modes and improve the performance of the transition. The proposed solution is experimentally verified, and measurement results show that the transition exhibits an average insertion loss of 2 dB across the frequency range 122-146 GHz which, to the best of the authors' knowledge, is the lowest reported loss for a D-band packaging solution in eWLB technology and hence addresses one of the main integration challenges facing millimetre-wave systems.

WR-6

eWLB packaging technology

frequency range 122-146 GHz

0 GHz to 170

5 standard waveguide

wafer level packaging

0 GHz

110-170 GHz

0 GHz

interconnect

frequency 122

band waveguide-to-microstrip transition

metal patches

patch-radiator-based waveguide transition

embedded wafer level ball grid array packaging technology

electromagnetic band-gap structure

patch radiates

D-band packaging solution

field effect MIMIC

microstrip transitions

eWLB technology

ball grid arrays

frequency 110

0 GHz to 146

photonic band gap

0 dB

noise figure 2

waveguide transitions

Author

Ahmed Adel Hassona

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Vessen Vassilev

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Zhongxia Simon He

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Ashraf Uz Zaman

Chalmers, Electrical Engineering, Communication and Antenna Systems, Antennas

C. Mariotti

Infineon Technologies

F. Dielacher

Infineon Technologies

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

Electronics Letters

0013-5194 (ISSN) 1350-911X (eISSN)

Vol. 56 4 187-+

Subject Categories

Other Physics Topics

Other Electrical Engineering, Electronic Engineering, Information Engineering

Condensed Matter Physics

DOI

10.1049/el.2019.3331

More information

Latest update

4/22/2020