D-band waveguide-to-microstrip transition implemented in eWLB packaging technology
Journal article, 2020
This Letter presents a non-galvanic D-band (110-170 GHz) interconnect realised in embedded wafer level ball grid array (eWLB) packaging technology. The interconnect consists of a patch-radiator-based waveguide transition implemented using one of the technology's redistribution layers. The patch radiates to a WR-6.5 standard waveguide perpendicular to its plane. An electromagnetic band-gap structure realised by metal patches is used to suppress undesired modes and improve the performance of the transition. The proposed solution is experimentally verified, and measurement results show that the transition exhibits an average insertion loss of 2 dB across the frequency range 122-146 GHz which, to the best of the authors' knowledge, is the lowest reported loss for a D-band packaging solution in eWLB technology and hence addresses one of the main integration challenges facing millimetre-wave systems.
WR-6
eWLB packaging technology
frequency range 122-146 GHz
0 GHz to 170
5 standard waveguide
wafer level packaging
0 GHz
110-170 GHz
0 GHz
interconnect
frequency 122
band waveguide-to-microstrip transition
metal patches
patch-radiator-based waveguide transition
embedded wafer level ball grid array packaging technology
electromagnetic band-gap structure
patch radiates
D-band packaging solution
field effect MIMIC
microstrip transitions
eWLB technology
ball grid arrays
frequency 110
0 GHz to 146
photonic band gap
0 dB
noise figure 2
waveguide transitions
Author
Ahmed Adel Hassona
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Vessen Vassilev
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Zhongxia Simon He
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Ashraf Uz Zaman
Chalmers, Electrical Engineering, Communication, Antennas and Optical Networks
C. Mariotti
Infineon Technologies
F. Dielacher
Infineon Technologies
Herbert Zirath
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Electronics Letters
0013-5194 (ISSN) 1350-911X (eISSN)
Vol. 56 4 187-+Subject Categories
Other Physics Topics
Other Electrical Engineering, Electronic Engineering, Information Engineering
Condensed Matter Physics
DOI
10.1049/el.2019.3331