Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails
Artikel i vetenskaplig tidskrift, 2009
The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits. © 2006 IEEE.
Gap waveguide
Microstrip circuit
Packaging
Mode suppression
Författare
Eva Rajo
Chalmers, Signaler och system, Kommunikation, Antenner och Optiska Nätverk
Ashraf Uz Zaman
Chalmers, Signaler och system, Kommunikation, Antenner och Optiska Nätverk
Per-Simon Kildal
Chalmers, Signaler och system, Kommunikation, Antenner och Optiska Nätverk
IEEE Microwave and Wireless Components Letters
1531-1309 (ISSN) 15581764 (eISSN)
Vol. 20 1 31-33 5339112Ämneskategorier
Annan elektroteknik och elektronik
DOI
10.1109/LMWC.2009.2035960