Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails
Artikel i vetenskaplig tidskrift, 2009

The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits. © 2006 IEEE.

Gap waveguide

Microstrip circuit

Packaging

Mode suppression

Författare

Eva Rajo

Chalmers, Signaler och system, Kommunikationssystem, informationsteori och antenner, Antennsystem

Ashraf Uz Zaman

Chalmers, Signaler och system, Kommunikationssystem, informationsteori och antenner, Antennsystem

Per-Simon Kildal

Chalmers, Signaler och system, Kommunikationssystem, informationsteori och antenner, Antennsystem

IEEE Microwave and Wireless Components Letters

1531-1309 (ISSN)

Vol. 20 1 31-33

Ämneskategorier

Annan elektroteknik och elektronik

DOI

10.1109/LMWC.2009.2035960

Mer information

Skapat

2017-10-07