Terahertz components packaging using integrated waveguide technology
Paper i proceeding, 2011

We present an integrated waveguide based packaging solution compatible with different THz component technologies, both for room temperature and cryogenic operations, employing space-qualified wire-bonding for electrical contacts. The proposed waveguide packaging relies on the combination of all-metal micro-machined THz waveguide and active component chip layouts suitable for the realization of systems from 200 up to 5000 GHz. It provides possibility of making 3-dimensional structures via facilitating of multi-level (layered) designs. The surface roughness of the fabricated THz waveguide structure was demonstrated to be 20 nm, while a 2 μm alignment accuracy of the active component chip was verified. © 2011 IEEE.

Submillimeter wave technology

Submillimeter wave devices

Integrated circuits packaging

Packaging

Författare

Vincent Desmaris

Chalmers, Rymd- och geovetenskap, Avancerad mottagarutveckling

Denis Meledin

Chalmers, Rymd- och geovetenskap, Avancerad mottagarutveckling

Dimitar Milkov Dochev

Chalmers, Rymd- och geovetenskap, Avancerad mottagarutveckling

Alexey Pavolotskiy

Chalmers, Rymd- och geovetenskap, Avancerad mottagarutveckling

Victor Belitsky

Chalmers, Rymd- och geovetenskap, Avancerad mottagarutveckling

2011 IEEE MTT-S International Microwave Workshop on Millimeter Wave Integration Technologies, IMWS 2011, Sitges 15 September 2011 through 16 September 2011

81-84 6061893

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1109/IMWS3.2011.6061893

ISBN

978-161284965-2