Waveguide Packaging Technology for THz Components and Systems

Paper i proceeding, 2011

We present an integrated THz waveguide packaging solution based on the combination of all-metal micro-machined THz waveguide technology and active component chip layouts suitable for the realization of systems from 200 up to 5000 GHz. This packaging solution is compatible with different THz component technologies, for room temperature and cryogenic operations and employs space-qualified wire-bonding for electrical contacting. The THz waveguide packaging provides possibility of making 3-dimensional structures via facilitating of multi-level (layered) designs. The surface roughness of the fabricated THz waveguide structure was demonstrated to be 20 nm, while the alignment accuracy of the active component chip was measured to be about 2 μm. Some of the demonstrators are already in used, at.e.g., APEX telescope in the SHeFI receiver.