Metamatrial based packaging method for improved isolation of circuit elements in microwave modules
Paper i proceeding, 2012

In this work, periodic structure has been used to design a new type of packaging technique to improve the isolation between microwave components within a module. In contrast to the conventional packaging technique, the new technique relaxes the requirement for using vias in the substrate and using conductive adhesive or gasket material within a typical multiple compartment microwave modules. On the other hand it uses a periodic structure of metal pins to form a lid for the microwave module. The achieved level of isolation in X-band and Ku-band for a two compartment test circuit is better than 65 dB which is better than the existing packaging technique within the band of interest.

mult-compartment microwave module

periodic structure

packaging method

electromagnetic interference

iolation

Författare

Ashraf Uz Zaman

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

Mubarak Ellis

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

Per-Simon Kildal

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

7th European Microwave Integrated Circuits Conference, EuMIC 2012 - Held as Part of 15th European Microwave Week, EuMW 2012; Amsterdam; Netherlands; 29 October 2012 through 30 October 2012

834-837

Ämneskategorier

Elektroteknik och elektronik

ISBN

978-2-87487-028-6

Mer information

Skapat

2017-10-07