Metamatrial based packaging method for improved isolation of circuit elements in microwave modules
Paper in proceedings, 2012

In this work, periodic structure has been used to design a new type of packaging technique to improve the isolation between microwave components within a module. In contrast to the conventional packaging technique, the new technique relaxes the requirement for using vias in the substrate and using conductive adhesive or gasket material within a typical multiple compartment microwave modules. On the other hand it uses a periodic structure of metal pins to form a lid for the microwave module. The achieved level of isolation in X-band and Ku-band for a two compartment test circuit is better than 65 dB which is better than the existing packaging technique within the band of interest.

mult-compartment microwave module

periodic structure

packaging method

electromagnetic interference

iolation

Author

Ashraf Uz Zaman

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Mubarak Ellis

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Per-Simon Kildal

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

7th European Microwave Integrated Circuits Conference, EuMIC 2012 - Held as Part of 15th European Microwave Week, EuMW 2012; Amsterdam; Netherlands; 29 October 2012 through 30 October 2012

834-837

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

ISBN

978-2-87487-028-6

More information

Created

10/7/2017