Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules
Artikel i vetenskaplig tidskrift, 2014
In this paper, perfect magnetic conductor (PMC)-based packaging technique was used to improve the isolation performance among various microwave circuit components such as high-gain amplifier chains. In this approach, a periodic structure (such as metal pin rows) together with the ground plane of the substrate created a stopband for unwanted parallel plate or cavity modes as well as substrate modes, and thereby suppressed the problems of circuit resonances and related package phenomena. This paper describes two Ka-band amplifier chains that were tested with this new packaging technique. Firstly, a single amplifier chain was tested for maximum stable gain operation, and it was found that the stable gain of >65 dB was achieved, whereas traditional metal wall package with RF absorber offered stable gain of 40 dB, thus showing significant isolation improvement. Secondly, two high-gain amplifier chains were placed side by side and their mutual isolation was tested. With the proposed gap waveguide packaging, a minimum isolation of 78 dB was achieved, whereas a complete metal shield provided a minimum isolation of only 64 dB over the band of interest.
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