Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules
Journal article, 2014

In this paper, perfect magnetic conductor (PMC)-based packaging technique was used to improve the isolation performance among various microwave circuit components such as high-gain amplifier chains. In this approach, a periodic structure (such as metal pin rows) together with the ground plane of the substrate created a stopband for unwanted parallel plate or cavity modes as well as substrate modes, and thereby suppressed the problems of circuit resonances and related package phenomena. This paper describes two Ka-band amplifier chains that were tested with this new packaging technique. Firstly, a single amplifier chain was tested for maximum stable gain operation, and it was found that the stable gain of >65 dB was achieved, whereas traditional metal wall package with RF absorber offered stable gain of 40 dB, thus showing significant isolation improvement. Secondly, two high-gain amplifier chains were placed side by side and their mutual isolation was tested. With the proposed gap waveguide packaging, a minimum isolation of 78 dB was achieved, whereas a complete metal shield provided a minimum isolation of only 64 dB over the band of interest.

ELECTROMAGNETIC BANDGAP

1995

NAILS

DESIGN

RESONANCE

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

LEAKAGE

SURFACES

P983

SUPPRESSION

HIGH-SPEED CIRCUITS

Isolation

stable gain

parallel-plate modes

V43

NOISE

MICROSTRIP

PMC packaging

DFORD TA

substrate modes

self-oscillation

Author

Ashraf Uz Zaman

Chalmers, Signals and Systems, Communication, Antennas and Optical Networks

Mats Alexanderson

R and D Section of Trebax AB

Tin Vukusic

R and D Section of Trebax AB

Per-Simon Kildal

Chalmers, Signals and Systems, Communication, Antennas and Optical Networks

IEEE Transactions on Components, Packaging and Manufacturing Technology

2156-3950 (ISSN) 21563985 (eISSN)

Vol. 4 1 16-25 6637079

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/tcpmt.2013.2271651

More information

Created

10/7/2017