Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules
Journal article, 2014
In this paper, perfect magnetic conductor (PMC)-based packaging technique was used to improve the isolation performance among various microwave circuit components such as high-gain amplifier chains. In this approach, a periodic structure (such as metal pin rows) together with the ground plane of the substrate created a stopband for unwanted parallel plate or cavity modes as well as substrate modes, and thereby suppressed the problems of circuit resonances and related package phenomena. This paper describes two Ka-band amplifier chains that were tested with this new packaging technique. Firstly, a single amplifier chain was tested for maximum stable gain operation, and it was found that the stable gain of >65 dB was achieved, whereas traditional metal wall package with RF absorber offered stable gain of 40 dB, thus showing significant isolation improvement. Secondly, two high-gain amplifier chains were placed side by side and their mutual isolation was tested. With the proposed gap waveguide packaging, a minimum isolation of 78 dB was achieved, whereas a complete metal shield provided a minimum isolation of only 64 dB over the band of interest.
ELECTROMAGNETIC BANDGAP
1995
NAILS
DESIGN
RESONANCE
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
LEAKAGE
SURFACES
P983
SUPPRESSION
HIGH-SPEED CIRCUITS
Isolation
stable gain
parallel-plate modes
V43
NOISE
MICROSTRIP
PMC packaging
DFORD TA
substrate modes
self-oscillation
Author
Ashraf Uz Zaman
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
Mats Alexanderson
R and D Section of Trebax AB
Tin Vukusic
R and D Section of Trebax AB
Per-Simon Kildal
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
IEEE Transactions on Components, Packaging and Manufacturing Technology
2156-3950 (ISSN) 21563985 (eISSN)
Vol. 4 1 16-25 6637079Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/tcpmt.2013.2271651