Gap Waveguide PMC Packaging for Improved Isolation of Circuit Components in High-Frequency Microwave Modules
Journal article, 2014
ELECTROMAGNETIC BANDGAP
1995
NAILS
DESIGN
RESONANCE
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
LEAKAGE
SURFACES
P983
SUPPRESSION
HIGH-SPEED CIRCUITS
Isolation
stable gain
parallel-plate modes
V43
NOISE
MICROSTRIP
PMC packaging
DFORD TA
substrate modes
self-oscillation
Author
Ashraf Uz Zaman
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
Mats Alexanderson
R and D Section of Trebax AB
Tin Vukusic
R and D Section of Trebax AB
Per-Simon Kildal
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
Published in
IEEE Transactions on Components, Packaging and Manufacturing Technology
2156-3950 (ISSN) 21563985 (eISSN)
Vol. 4 Issue 1 p. 16-25 art. no 6637079Categorizing
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
DOI
10.1109/tcpmt.2013.2271651