Prospective new PMC based gap waveguide shielding for microwave modules
Paper i proceeding, 2014

In this paper we present a general overview of Gap Waveguide shielding or packaging technique applied in various passive or active microwave modules in order to improve the electrical performance of the respective modules. In this new packaging approach, we use periodic structures to achieve a stop-band by enforcing cutoff condition for all global parallel-plate modes even within an oversized microwave mechanical assembly. Within this stop-band, we are able to suppress all unwanted cavity modes, substrate modes, unwanted EMI and RF feedback, thereby improving the overall system performance. In this work, we recapitulate several realizations of gap waveguide packaging solution, relevant for both high frequency and low frequency microwave applications.



imperfect joints

oversized cavity

parallel-plate modes

substrate modes


Ashraf Uz Zaman

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

Eva Rajo

Universidad Carlos III de Madrid

Per-Simon Kildal

Chalmers, Signaler och system, Kommunikations- och antennsystem, Antennsystem

IEEE International Symposium on Electromagnetic Compatibility, EMC Europe 2014; Swedish Exhibition and Congress CentreGothenburg; Sweden; 1 September 2014 through 4 September 2014

2158-1118 (eISSN)



Annan elektroteknik och elektronik



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