Packaging of MMIC by using gap waveguide and design of a microstrip to ridge gap waveguide transition

Paper i proceeding, 2013

In this work, gap waveguide based packaging technique is used to improve the isolation among critical microwave circuit components such as high gain amplifier chain. Amplifier chains at Ka-band were tested for a stable forward gain and it was found that-with gap waveguide packaging, 65∼70dB of forward gain is achievable without the problem of self-resonance. Apart from the new packaging technique, a low-loss transition from microstrip to ridge-gap waveguide had been designed and tested. This transition is a key component to connect such amplifier chains to a planar slot array antenna. Experimental results for manufactured back to back transition show 14 dB return loss over 55% relative bandwidth from 2343GHz.