Packaging of MMIC by using gap waveguide and design of a microstrip to ridge gap waveguide transition
Paper in proceedings, 2013

In this work, gap waveguide based packaging technique is used to improve the isolation among critical microwave circuit components such as high gain amplifier chain. Amplifier chains at Ka-band were tested for a stable forward gain and it was found that-with gap waveguide packaging, 65∼70dB of forward gain is achievable without the problem of self-resonance. Apart from the new packaging technique, a low-loss transition from microstrip to ridge-gap waveguide had been designed and tested. This transition is a key component to connect such amplifier chains to a planar slot array antenna. Experimental results for manufactured back to back transition show 14 dB return loss over 55% relative bandwidth from 2343GHz.

Slot-array antenna

PMC

Ridge gap waveguide

PEC

Cross-talk

feedback

self-oscillation

Author

Ashraf Uz Zaman

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

Per-Simon Kildal

Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner, Antennas

2013 3rd Asia-Pacific Microwave Conference, APMC 2013; Seoul; South Korea; 5 November 2013 through 8 November 2013

10-12

Subject Categories

Signal Processing

DOI

10.1109/APMC.2013.6695174

ISBN

978-147991474-6

More information

Created

10/7/2017