Flip Chip Assembly of a 40-60 GHz GaAs Microstrip Amplifier
Konferensbidrag (offentliggjort, men ej förlagsutgivet), 2004

This paper describes the successful flip chip assembly of a broadband GaAs amplifier in microstrip design. The flip chip technology used was thermo compression (TC) flip chip bonding of the MMICs to gold ball bumps bonded on the thin film patterned alumina carrier. Also, we report on the occurrence of parasitic parallel plate (PPL) modes in the assemblies and we propose and investigate a scheme to eliminate the modes which, to the best our knowledge, have not been reported on before. Finally we introduce our own flip chip transition equivalent circuit and we use this model in ADS to compare the simulated results with measurements. It is fair to say that the equivalent circuit models the flip chip transition well. This work was performed in the European MEDEA+ packaging project HIMICRO.

flip chip

amplifier

GaAs

MMIC

stud bump

thermo compression

Författare

Camilla Kärnfelt

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Herbert Zirath

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Piotr Starski

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Janusz Rudnicki

Chalmers, Mikroteknologi och nanovetenskap (MC2), Mikrovågselektronik

Proceedings of 34th European Microwave Conference

Vol. 1 1 89-92

Ämneskategorier

Elektroteknik och elektronik