Passive Si3N4 photonic integrated platform at 1μm for short-range optical interconnects
Paper i proceeding, 2019

With the increasing development of cloud services, a large number of high-speed optical interconnects are needed in large-scale datacenters. Future datacenters will require short-range links with multi-Tb/s interconnect capacity, i.e. more than an order of magnitude higher than what is available today with vertical-cavity surface-emission lasers (VCSELs) or silicon photonics. In addition, large-scale datacenters will require longer (> 1km) transmission links. Single-mode GaAs VCSELs today provide transmission speeds ∼ 100 Gb/s, close to their fundamental limit. The recent development of high-speed GaAs VCSELs at a slightly longer wavelength of opens a path forward for low-energy dissipation, high-speed, long-reach optical interconnects because the chromatic dispersion and attenuation in fibers are significantly reduced compared to shorter wavelengths [1]. In order to meet the future capacity prospects, we envision the use of multi-wavelength GaAs VCSEL arrays at 1 μm with advanced multi-fiber cables. This vision requires the use of a low-cost, low-loss passive integrated photonic platform for laser integration, multiplexing, and fiber interfacing, as sketched in Figure (a). Here, we present a silicon nitride (henceforth SiN) platform that can meet these requirements.

Författare

Xiaonan Hu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Zhichao Ye

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Marcello Girardi

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Pascual Muñoz

Universitat Politecnica de Valencia (UPV)

Anders Larsson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Victor Torres Company

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019

8872184

2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019
Munich, Germany,

Ämneskategorier

Kommunikationssystem

DOI

10.1109/CLEOE-EQEC.2019.8872184

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Senast uppdaterat

2020-03-06