Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition
Paper i proceeding, 2021
In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.
system integration
millimeter-wave integrated circuits
spatial power combiners
impedance matching
power amplifiers
waveguide transitions
Co-design
Författare
Piyush Kaul
Technische Universiteit Eindhoven
Alhassan Aljarosha
Technische Universiteit Eindhoven
Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem
A. B. Smolders
Technische Universiteit Eindhoven
Marion Matters-Kammerer
Technische Universiteit Eindhoven
Rob Maaskant
Technische Universiteit Eindhoven
Chalmers, Elektroteknik, Kommunikations- och antennsystem
EuMIC 2020 - 2020 15th European Microwave Integrated Circuits Conference
217-220 9337459
15th European Microwave Integrated Circuits Conference, EuMIC 2020
Utrecht, Netherlands,
Utrecht, Netherlands,
Ämneskategorier
Telekommunikation
Kommunikationssystem
Annan elektroteknik och elektronik
DOI
10.1109/EuMIC48047.2021.00066