Spatial Power Combining and Impedance Matching Silicon IC-to-Waveguide Contactless Transition
Paper i proceeding, 2021

In this paper a new multi-step joint-design approach is described for a multi-channel power amplifier integrated with an IC-to-Waveguide transition. The approach enables an optimal impedance match of a waveguide to an integrated-circuit via a contactless transition. Spatial power combining with a non-isolated contactless transition is achieved in the input and output networks of the power amplifier. Simulation results are presented which are in agreement with the joint-design requirements. This methodology enables IC-to-Waveguide integration and provides a suitable approach for mm-wave system integration.

system integration

millimeter-wave integrated circuits

spatial power combiners

impedance matching

power amplifiers

waveguide transitions

Co-design

Författare

Piyush Kaul

Technische Universiteit Eindhoven

Alhassan Aljarosha

Technische Universiteit Eindhoven

Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem

A. B. Smolders

Technische Universiteit Eindhoven

Marion Matters-Kammerer

Technische Universiteit Eindhoven

Rob Maaskant

Technische Universiteit Eindhoven

Chalmers, Elektroteknik, Kommunikations- och antennsystem

EuMIC 2020 - 2020 15th European Microwave Integrated Circuits Conference

217-220 9337459

15th European Microwave Integrated Circuits Conference, EuMIC 2020
Utrecht, Netherlands,

Ämneskategorier

Telekommunikation

Kommunikationssystem

Annan elektroteknik och elektronik

DOI

10.1109/EuMIC48047.2021.00066

Mer information

Senast uppdaterat

2021-03-18