Performance Analysis of an Integrated Multi-Channel Power Amplifier Incorporating an IC-to-Waveguide Transition
Paper i proceeding, 2021

This paper studies the power combiner efficiency of multiple Power Amplifier (PA) output signals that are combined within a low-loss contactless transition, intrinsically having low isolation characteristics. Since the PA performance is sensitive to load impedance variations, poor isolation may affect each PA performance, thereby reducing the overall power combiner efficiency. Load impedance variations can e.g. be due to process, supply-voltage and temperature variations. A four-way spatial power combiner (SPC) design is compared to an on-chip Wilkinson Power Combiner (WPC) implemented in 0.13 mu m SiGe BiCMOS technology incorporating a 50 Omega impedance matching network. The WPC occupies 84% more area than the non-isolating SPC. Moreover, the non-isolating SPC has an average efficiency 14% larger than the WPC. For physically realistic variations, simulated results show a sigma-variation of 2.81 mW in P-out and 0.87 % in PAE for the non-isolating SPC, and 2.34 mW in P-out and 0.45 % in PAE for the WPC (@1 dB compression).

system integration

spatial power combiner

Wilkinson power combiner

millimeter-wave integrated circuits

power amplifiers

PVT variations

power combining efficiency

waveguide transitions

Impedance matching

Författare

Alhassan Aljarosha

Chalmers, Elektroteknik, Kommunikations- och antennsystem, Antennsystem

Technische Universiteit Eindhoven

Piyush Kaul

Technische Universiteit Eindhoven

A. B. Smolders

Technische Universiteit Eindhoven

Marion K. Matters-Kammerer

Technische Universiteit Eindhoven

Rob Maaskant

Chalmers, Elektroteknik, Kommunikations- och antennsystem

Technische Universiteit Eindhoven

2021 15TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP)

2164-3342 (ISSN)

Ämneskategorier

Telekommunikation

Kommunikationssystem

Annan elektroteknik och elektronik

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Senast uppdaterat

2021-08-24