Graphene-based thermal interface materials with high through-plane thermal conductivity inspired by Baumkuchen
Artikel i vetenskaplig tidskrift, 2026

To enhance the thermal management capabilities of epoxy composite, inspired by Baumkuchen, a simple, scalable, and environmentally friendly process was proposed. The graphene strips, without any chemical modification, were integrated into assembled graphene paper, and the vertically aligned graphene strips/epoxy composite with the tree-ring structure was prepared by the rolling cutting method. The composite exhibited an extremely high through-plane thermal conductivity of 49.2 W / mK, which was 289 times higher than that of pure EP. Additionally, the composite also possesses a range of desirable properties, including good electromagnetic interference shielding, efficient Joule heating, and remarkable mechanical performance. These properties further expand the application of graphene-based thermal interface materials in the field of thermal management of electronic devices.

Författare

Sihua Guo

Shanghai University

Minghe Wang

Shanghai University

Si Chen

Shanghai Ruixi New Material High-Tech Ltd

Kristoffer Harr Martinsen

SHT Smart High-Tech

Yong Zhang

Shanghai University

Y. Zhang

Shanghai University

Bin Wei

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

Applied Physics Letters

0003-6951 (ISSN) 1077-3118 (eISSN)

Vol. 128 10 102201

Styrkeområden

Produktion

Ämneskategorier (SSIF 2025)

Bearbetnings-, yt- och fogningsteknik

Kompositmaterial och kompositteknik

DOI

10.1063/5.0310419

Mer information

Senast uppdaterat

2026-04-21