BEM-Based Characterization of a D-Band On-Chip Patch Antenna Array

Paper i proceeding, 2026

This work combines the first contactless over-the-air measurement of a D-band on-chip antenna with a boundary element method simulation workflow. The contactless characterization is based on backscattering modulation and is demonstrated above 100 GHz for an integrated on-chip antenna without coaxial or waveguide interfaces. The approach cross validates these measurements with Boundary Element Method (BEM) simulation and then goes on to demonstrate the value of this simulation approach by achieving order-of-magnitude computational savings over FEM and uniquely enabling full array simulations of sub-THz antenna designs without array approximations such as repeating boundary conditions and array factor.