Towards Carbon Nanotube-based off-Chip Interconnects
Licentiatavhandling, 2009
densification
through silicon via (TSV)
transfer
carbon nanotube (CNT)
planarization
interconnect
Författare
Teng Wang
Chalmers, Mikroteknologi och nanovetenskap
Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
Applied Physics Letters,; Vol. 91(2007)p. 093123-
Artikel i vetenskaplig tidskrift
Ämneskategorier
Elektroteknik och elektronik
Technical report MC2 - Department of Microtechnology and Nanoscience, Chalmers University of Technology
Fasrummet
Opponent: Krisztián Kordás