3D Printed Periodic Structures for RF Packaging of Integrated Array Module at sub-6GHz Band

Paper i proceeding, 2021

Wideband PMC packaging solution fabricated by low cost 3D printing technology has been proposed as an alternative to conventional metal wall solution for isolating critical active circuits in integrated arrays operating at sub-6GHz. The two proposed periodic structures named as triangular pins and conical pins produce a parallel-plate stopband over the frequency range from 2.5-6GHz and 2.1-5.5GHz respectively. A test structure, containing passive microstrip lines placed on a FR4 substrate, has been used to verify the packaging performance of the proposed 3D printed structures and the measured isolation performance of the newly proposed periodic structures agree very well with the simulated performance. Isolation level better than 40-50dB has been demonstrated within the band of interest.