Affordable smart GaN IC solutions as enabler of greener applications (ALL2GaN)
Research Project, 2023
– 2026
ALL2GaN will be the backbone for the European Power Electronics Industry by offering an EU-born smart GaN Integration Toolbox. The project will provide the base for applications with significantly increased material- and energy efficiency, thus meeting the global energy needs while keeping the CO2 footprint to the minimum.
46 partners from 12 European countries will collaborate on 8 major objectives along the entire vertical value chain of power and RF electronics.
O1: Push the limits of industrial GaN devices and system-on-chip approaches for ≤ 100V
O2: Leverage the full potential of innovative substrates for GaN
O3: Achieve novel benchmark solutions for lateral GaN devices and integrated circuits ≥ 650V
O4: Reach best technical and cost performance of RF GaN on Si with novel integration concepts
O5: Break the packaging limits by application driven integrated solutions of high performance GaN products
O6: Advance the methods to evaluate and optimize reliability and robustness of GaN components, modules, and systems for shortest time-to-market and maximum product availability at the end user
O7: Demonstrate highest affordable performance for greener power electronics and RF applications
O8: Road-mapping for the future GaN technology development and applications to support long-term exploitation/business cases and European leadership beyond ALL2GaN.
The collaboration in ALL2GaN is based on a work package structure covering activities on novel power- and RF-GaN technologies for various voltage classes, latest packaging technologies, research on reliability and demonstration in 11 Use Cases.
With ambitious goals and a clear vision, ALL2GaN will unleash the energy saving and material efficiency potential of GaN semiconductors for a broad field of applications, thus being in line with the major challenges outlined in the ECS-SRIA. ALL2GaN technology will directly contribute to energy saving and cutting-edge green technology innovation as…Every Watt counts!
Participants
Gregor Lasser (contact)
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Christian Fager
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Lucian Petrisor Ion
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Mattias Thorsell
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Hossein Zaheri
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Collaborations
Aalborg University
Aalborg, Denmark
Aixtron SE
Herzogenrath, Germany
ALIXLABS AB
Lund, Sweden
APPLIED MICRO ELECTRONICS AME
Eindhoven, Netherlands
Attolight
Ecublens, Switzerland
BALLARD POWER SYSTEMS EUROPE
Hobro, Denmark
Brno University of Technology
Brno, Czech Republic
CE-LAB GMBH
Ilmenau, Germany
CHEMNITZER WERKSTOFFMECHANIK
Chemnitz, Germany
Corintis SA
Rolle, Switzerland
Delft University of Technology
Delft, Netherlands
Delta Electronics
Taipei, Taiwan
Eindhoven University of Technology
Eindhoven, Netherlands
Ericsson
Stockholm, Sweden
FOR OPTIMAL RENEWABLE ENERGY SYSTEMS SL
Zaragoza, Spain
Foundation for Research and Technology Hellas (FORTH)
Heraklion, Greece
Fraunhofer-Gesellschaft Zur
Munchen, Germany
FRONIUS INTERNATIONAL
Pettenbach, Austria
Heraeus Materials Technology
Hanau, Germany
Ikerlan s. Coop
Mondragon, Spain
IMST GmbH
Kamp-Lintfort, Germany
Infineon Technologies
Neubiberg, Germany
Infineon Technologies
Neubiberg, Germany
Institut für Mikroelektronik Stuttgart
Stuttgart, Germany
Interuniversitair Micro-Elektronica Centrum (IMEC)
Leuven, Belgium
KAI KOMPETENZZENTRUM AUTOMOBIL - UND INDUSTRIEELEKTRONIK
Villach st magdalen, Austria
MINDCET
Leuven, Belgium
Mondragon Goi Eskola Politeknikoa J M A S Coop
Arrasate, Spain
NaMLab
Dresden, Germany
NANO DESIGN SRO
Bratislava, Slovakia
NANOWIRED
Gernsheim, Germany
NEXPERIA BV
Nijmegen, Netherlands
PREMIUM SA
Barcelona, Spain
RISE Research Institutes of Sweden
Göteborg, Sweden
Signify
Eindhoven, Netherlands
SILICON AUSTRIA LABS
Graz, Austria
Slovak University of Technology Bratislava
Bratislava, Slovakia
SweGaN AB
Linköping, Sweden
Swiss Federal Institute of Technology in Lausanne (EPFL)
Lausanne, Switzerland
Technical University of Madrid
Madrid, Spain
Technische Universität Chemnitz
Chemnitz, Germany
Technische Universität Graz
Graz, Austria
Thermo Fisher Scientific
Waltham, United States
Vienna University of Technology
Wien, Austria
Funding
VINNOVA
Project ID: 2023-00451
Funding Chalmers participation during 2023–2026
European Commission (EC)
Project ID: EC/HE/101111890
Funding Chalmers participation during 2023–2026
Related Areas of Advance and Infrastructure
Information and Communication Technology
Areas of Advance
Kollberg Laboratory
Infrastructure
Sustainable development
Driving Forces
Nanoscience and Nanotechnology
Areas of Advance