Plasma assisted low temperature wafer bonding: void formation in the oxide free interface
Paper in proceedings, 2003

Author

Petra Amirfeiz

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Anke Sanz-Velasco

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Stefan Bengtsson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 7th International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Paris, France (2003)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/7/2017