Analysis of CV characterisitcs of plasma bonded wafers
Paper in proceeding, 2002

Author

Cindy Colinge

Stefan Bengtsson

Department of Microelectronics

Petra Amirfeiz

Department of Microelectronics

Anke Sanz-Velasco

Presented at TMS, Electronics Materials Conference, Santa Barbara, USA

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017