Analysis of CV characterisitcs of plasma bonded wafers
Paper in proceeding, 2002
Author
Cindy Colinge
Stefan Bengtsson
Department of Microelectronics
Petra Amirfeiz
Department of Microelectronics
Anke Sanz-Velasco
Presented at TMS, Electronics Materials Conference, Santa Barbara, USA
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering