On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams
Journal article, 2011

A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations

Thin film testing

Fracture strength of silicon

Silicon nanowires

Piezoresistivity

Mechanical and electro-mechanical properties of silicon

Surface states

Environmental impact on measurement

On-chip tensile testing

MEMS/NEMS

Nano-mechanical testing

Fracture

Author

U. Bhaskar

V. Passi

Ulf Södervall

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

Bengt Nilsson

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

Göran Petersson

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

Mats Hagberg

Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory

T. Pardoen

J.-P. Raskin

Advanced Materials Research

1022-6680 (ISSN) 1662-8985 (eISSN)

Vol. 276 117-126

Subject Categories

Physical Sciences

DOI

10.4028/www.scientific.net/AMR.276.117

More information

Created

10/7/2017