On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams
Journal article, 2011
Thin film testing
Fracture strength of silicon
Silicon nanowires
Piezoresistivity
Mechanical and electro-mechanical properties of silicon
Surface states
Environmental impact on measurement
On-chip tensile testing
MEMS/NEMS
Nano-mechanical testing
Fracture
Author
U. Bhaskar
V. Passi
Ulf Södervall
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Bengt Nilsson
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Göran Petersson
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
Mats Hagberg
Chalmers, Microtechnology and Nanoscience (MC2), Nanofabrication Laboratory
T. Pardoen
J.-P. Raskin
Advanced Materials Research
1022-6680 (ISSN) 1662-8985 (eISSN)
Vol. 276 117-126Subject Categories
Physical Sciences
DOI
10.4028/www.scientific.net/AMR.276.117