On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams
Artikel i vetenskaplig tidskrift, 2011

A simple and versatile on-chip tensile testing method is proposed for the statistical evaluation of size effects on the mechanical strength of silicon thin films along with the simultaneous study of (from low to ultra) strain effects on the carrier transport. Mechanical results are presented on the fracture strength of micro-nano scale silicon beams, followed with a discussion on interface states and problems facing reliable nano-electronic and nano-electromechanical characterizations

Thin film testing

Fracture strength of silicon

Silicon nanowires

Piezoresistivity

Mechanical and electro-mechanical properties of silicon

Surface states

Environmental impact on measurement

On-chip tensile testing

MEMS/NEMS

Nano-mechanical testing

Fracture

Författare

U. Bhaskar

V. Passi

Ulf Södervall

Chalmers, Mikroteknologi och nanovetenskap (MC2), Nanotekniklaboratoriet

Bengt Nilsson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Nanotekniklaboratoriet

Göran Petersson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Nanotekniklaboratoriet

Mats Hagberg

Chalmers, Mikroteknologi och nanovetenskap (MC2), Nanotekniklaboratoriet

T. Pardoen

J.-P. Raskin

Advanced Materials Research

1022-6680 (ISSN) 1662-8985 (eISSN)

Vol. 276 117-126

Ämneskategorier

Fysik

DOI

10.4028/www.scientific.net/AMR.276.117