Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range
Journal article, 2012
nails
soft surfaces
packaging
parallel plate mode
Artificial magnetic conductor (AMC)
electromagnetic-bandgap
gap waveguide
Author
Eva Rajo
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
Per-Simon Kildal
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
Ashraf Uz Zaman
Chalmers, Signals and Systems, Communication, Antennas and Optical Networks
A. Kishk
Concordia University
IEEE Transactions on Components, Packaging and Manufacturing Technology
2156-3950 (ISSN) 21563985 (eISSN)
Vol. 2 10 1623-1628 6280647Areas of Advance
Information and Communication Technology
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/TCPMT.2012.2207957