Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range
Artikel i vetenskaplig tidskrift, 2012

After the use of the bed of nails for removing cavity modes in microstrip circuit packages, we propose herein a new version of this periodic structure, based on helices (springs) instead of nails. This new structure, named bed of springs, is much more compact, and this allows its use at low frequencies where the bed of nails is not suitable as it is too bulky due to the required height of the nails (pins). The bandwidth of the proposed structure turns out to be similar to the case of bed of nails. Parametric studies are presented as a design tool and a demonstrator is manufactured and measured.

nails

soft surfaces

packaging

parallel plate mode

Artificial magnetic conductor (AMC)

electromagnetic-bandgap

gap waveguide

Författare

Eva Rajo

Chalmers, Signaler och system, Kommunikationssystem, informationsteori och antenner, Antennsystem

Per-Simon Kildal

Chalmers, Signaler och system, Kommunikationssystem, informationsteori och antenner, Antennsystem

Ashraf Uz Zaman

Chalmers, Signaler och system, Kommunikationssystem, informationsteori och antenner, Antennsystem

A. Kishk

Université Concordia

IEEE Transactions on Components, Packaging and Manufacturing Technology

2156-3950 (ISSN)

Vol. 2 1623-1628 6280647

Styrkeområden

Informations- och kommunikationsteknik

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1109/TCPMT.2012.2207957