Wafer bonding using oxygen plasma treatment in RIE and ICP RIE
Journal article, 2001

Author

Anke Sanz-Velasco

Department of Microelectronics

Other publications Research

Petra Amirfeiz

Department of Microelectronics

Stefan Bengtsson

Department of Microelectronics

Other publications Research

Proc. 6th International Symposium on Semiconductor Wafer Bonding. The Electrochemical Society.

Vol. 2001 27 31-40

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/7/2017

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